About to ICAMCL 2025
The 2025 International Conference on Aerospace and Mechanical Applications will be grandly held in Shanghai. This conference brings together top experts, scholars, and industry elites in the field of aerospace and mechanical applications from around the world to discuss the latest research achievements, technological trends, and future development directions in the field of aerospace and mechanical applications. During the conference, attendees will engage in in-depth discussions on multiple topics related to aerospace and mechanical applications, including but not limited to key areas such as high-performance materials, advanced manufacturing technology, and intelligent control systems. At the same time, the conference will also invite several well-known experts and scholars to give keynote speeches, sharing their latest research achievements and practical experience in the fields of aerospace and mechanical applications. This conference not only provides a platform for attendees to showcase the latest technologies and exchange academic ideas, but also injects new impetus into promoting innovation and development in the fields of aerospace and mechanical applications. Attendees will have the opportunity to gain in-depth understanding of the latest developments in the field of aerospace and mechanical applications, expand cooperation opportunities, and jointly promote technological progress and industrial upgrading in this field. As an international and high-level academic conference, the 2025 International Conference on Aerospace and Mechanical Applications will inject new vitality into the development of the global aerospace and mechanical application field, and promote the field towards a broader future.
Record
All full paper submissions to the ICAMCL 2025 could be written in English and will be sent to at least two reviewers and evaluated based on originality, technical or research content or depth, correctness, relevance to conference, contributions, and readability. All accepted papers of ICAMCL 2025 will be published in the conference proceedings, which will be submitted to EI Compendex, Scopus for indexing.
Submission Portal
Mail Address: icamcl@sub-paper.com
If you have any question or need any assistance regarding the conference, please feel free to contact our conference specialists;
- 王老师
- TEL：13260780457 (微信同号)
- QQ：2031670594
- E-mail：icamcl@sub-paper.com
Important Dates
Submission Deadline：2025-03-27
Registration Deadline：2025-04-03
Conference Date：2025-04-10
Notification Date：About a week after the submission
CALL FOR PAPERS
Theme 1: Aerospace intelligent system intelligent control Gas Physics Electrical automation distributed control system Aerospace structures Aerospace computing Aircraft anti icing system Plasma Physics Ejection lifesaving technology Material surface physics Intelligent management and decision-making Aircraft Flight Dynamics Satellites and Geophysics Gas liquid two-phase flow and heat transfer Thermal control technology for spacecraft High performance materials and coatings Beidou Navigation and Positioning System The application of satellite remote sensing technology Drive Motor and Control Technology Fuzzy Control and Fuzzy Systems Human computer modeling and simulation Special functional materials and material design Non equilibrium materials and their preparation techniques Aircraft and Vehicle Environmental Control Technology Power battery management and maintenance technology Material Failure Analysis and Prediction Prevention Advanced Material Preparation Science and Forming Technology New polymer materials and advanced resin based composite materials Topic 2: Mechanical Applications electromagnetics Structural class Electrical integration CNC technology Vehicle Engineering Aerospace Smart grid Electrical Engineering electric control Electric energy processing Optoelectronic information Electrical testing power equipment Materials Engineering material processing Mechanical materials Aviation materials magnetic material Material modeling Energy materials mineral resources Processing and manufacturing Energy and Electrical High performance materials Process technology Energy and Power Engineering Instrumentation and equipment Mechanical and Electronic Engineering 3D printing technology Principles of Automatic Control Precision Manufacturing and Measurement Mechanical and Electrical Transmission and Control Electronics and Integrated Circuits Electronic and Electrical Materials Material Forming and Design High voltage and insulation technology Electrical Theory and New Technologies Deformation and fracture of materials Mechanical Manufacturing and Automation Power Electronics and Power Transmission Power system and its automation Coatings, corrosion, and surface engineering, etc [All relevant topics are eligible for submission]
..... View more themes>>About Plagiarism Check
Crosscheck Powered by iThenticate will be used for plagiarism check. The amount of duplication from previously published content should be less than 20%; If the amount of duplication is 20% - 35%, modification maybe required; if the amount of duplication exceeds 35%, the article will be rejected. Please note that there will be no refund for no-shows.
Indexing Service
中文特别声明
出版社在论文出版前会对论文重复率进行检测，重复率大于20%的稿件将被拒绝出版；重复率不大于20%的稿件中，如有整段大面积的直接复制其他作者文章内容的情况，也会被拒绝出版。以上两种涉及抄袭的情况，一旦被出版社证实，文章将被拒绝出版，并且不退回任何会议注册费用。
Technical Sponsor
Submission Guidelines
Submit
Please submit the full text/abstract
of the paper to us through the elec
tronic submission system
Call for Reviewers
As a platform for global academic communication, the quality of conference publication has always an aspect attracting much of our attention. To ensure quality of our publication and to better serve the peers in academic circle, we now call for reviewers among professionals and experts of the world. Professionals and experts who hold PhD (doctoral) degree in the conference related areas are encouraged to join in us and together, we will work hard to become a world-class academic conference. Please send us your CV by email (icamcl@sub-paper.com) if you are interested in it.
SCI JOURNAL
Contributors are encouraged to submit papers / abstracts to the conference. The organizing committee will select high-quality papers and recommend them to SCI/SSCI journals. For specific matters, please contact the person in charge of the conferrence.
Submission Guidelines
Delegates are encouraged to submit their papers/abstracts to the conference. Good quality papers will be selected by the organizing committee and Prof. Soteris Kalogirou, the editor in chief. After it, the authors will be invited to extent their papers/abstracts and submit them to icamcl@sub-paper.com. The normal size of research papers is 4,000-6,000 words excluding abstract and references.